Product Features

• SUPERIOR THERMAL CONDUCTIVITY: With an impressive thermal conductivity of 2 W/mK, this thermal adhesive ensures efficient heat dissipation and maximum performance of your electronic components.
• ULTIMATE ADHESION: HighTechCOM thermal adhesive ensures excellent adhesion even with heavy heat sinks, ensuring optimal cooling of your devices and a longer service life.
• EASY APPLICATION & FAST CURING: Our thermally conductive adhesive is easy to apply and dries quickly, allowing you to install your electronic components efficiently and safely. Thickness: 0.1-0.5 mm; after 20 minutes of drying time, the application is already touch-dry. 24 hours of curing for thicknesses over 0.5 mm.
• ELECTRICALLY INSULATING & SAFE: This thermal adhesive is electrically insulating, preventing short circuits and protecting your devices from damage. Trust the safety of our advanced formula.
• Temp: -60° to 250° C. VERSATILE & ECONOMICAL: The generous 100g package is ideal for numerous applications, including heatsinks, LEDs, RAM, SMDs, GPUs, ICs, SSDs, chipsets, control boards, and many other electronic components.